KAIST to develop pliant high-volume semiconductors

2013_03_pliantOn Tuesday, KAIST said, a research team led by KAIST professor Kim Sang-wook, successfully developed 20㎚ ultra-fine patterns by leveraging the world’s best molecular assembly technology.

Molecular self-assembly (the process by which molecules adopt a defined arrangement without guidance or management from an outside source) was put to good use in making such an achievement. Molecular self-assembly enables the efficient formation of otherwise hard-to-obtain nanostructures by allowing pliant macromolecules to self-assemble.

The research team formed ultra-fine patterns by using a molecular assembly technology called “block copolymers” and then placed the ultra-fine patterns on flexible substrates, such as 3D substrates, PET (polyethylene terephthalate) and PDMS, to create nanostructures freely. As a result, the KAIST research team has paved the way for manufacturing semiconductors that are pliant and capable of storing large volumes of data. The team expected that its R&D result would contribute to the development of high-performance, flexible electronic devices.

Professor Kim said, “It has been difficult to commercialize bendable semiconductors that have been unveiled so far, because they used temperature-sensitive plastic substrates. Meanwhile,   our team used as circuit boards grapheme that boasts excellent mechanical properties.”

Source: Korea IT Times.

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