Overheating of smartphones is increasingly becoming a problem as users worldwide stay connected longer and more frequently with high-speed fourth-generation Long Term Evolution services. In response, some of the top smartphone makers are expected to incorporate a high-precision water-cooled pipe technology into future devices, according to cooling module manufacturers.
Samsung Electronics, Apple and HTC have recently shown interest in adopting the new cooling technology for their future models. The conventional graphite and foil cooling method currently being used in smartphones fails to effectively dissipate heat generated by the device’s core parts. In May, Japanese tech corporation NEC released the first Android-based water-cooled smartphone ― Medias X06E ― with a 0.6-millimeter cooling pipe in the chip.
For full article, see Korea Herald.