Samsung Electronics is ready to soon market its “one-chip” solution in a bid to snatch the lead in the next generation of wearable and flexible devices. “In September, we started to mass produce the one-chip, which is a combination of the AP and modem chips. We believe the chips will be fitted into actual devices in the near future,” said Woo Nam-sung, head of Samsung Electronics System LSI unit at Samsung’s investor relations session last week.
The name of the one-chip will be “ModAP,” a term combining the words modem and AP to indicate that both the application processor and modem capabilities are offered on a single chip. Once the ModAP chips become commercialized ― Samsung has yet to say when ― it will have significant repercussions throughout the industry and at Samsung, experts say.
“In the short term, the chip would help cut costs, but in the longer term, it’s going to help Samsung prepare for the next generation device battle that will inevitably involve wearable devices and truly flexibly displays,” said Noh Geun-chang, a senior analyst for HMC Securities. Samsung’s biggest mistake in the device war was allowing Apple to take the lead in smartphones. The Korean tech giant is determined not to be outdone this time.
For full article, see Korea Herald.